27 Jul 2023

CUHK Robotics Open Day and Collaboration Agreement Signing Ceremony with HKSTP, Lenovo and HKCLR

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The Chinese University of Hong Kong (CUHK)’s T Stone Robotics Institute (CURI) joined hands with Hong Kong Science and Technology Park Corporation (HKSTP) to organise the CUHK Robotics Open Day at HKSTP today (27 July), showcasing its leading innovations to the public.

Key Takeaways

  • CUHK Robotics Open Day showcased more than 30 cutting-edge robotics innovations and novel projects by the CUHK Robotics Team, start-up companies and InnoHK.
  • Today, HKSTP, Lenovo Group and CUHK’s Hong Kong Centre for Logistics Robotics (HKCLR) also signed a collaboration agreement to co-incubate young talents in robotics and AI technologies.
  • This collaboration aims to accelerate the pace of technology transfer and commercialisation of world-class R&D outcomes including cutting-edge robotics technologies, thus enhancing Hong Kong’s innovation and technological development.