Senior Engineer of Etching module
Job Responsibilities
- Responsible for SiC Diode/MOS Automotive and Industrial grade products qualification in relating to AEC-Q101 and JDEC standard.
- Develop Unit Process for Etch (Dry and Wet) and further optimization of the recipe.
- Support PIE to further improve Product yield and defect performance.
- Process and Metrology Tools’ Qualification from Tier 2 to Tier 3.
- Establishment Unit process capability by setting up SPC/APC/FDC to achieve CP/CpK >=1.33 minimum.
- Carry out required DOE (Design of Experiment) on each TD platform’s Unit process to improve the overall Product specification margin.
- Ability to complete the work delivered by the superiors independently.
Job Requirements
- Bachelor's degree or above in microelectronics and semiconductor materials, with more than 5 years’ experience in etching module in Si wafers processing, or 2 years’ experience in SiC direct products (JBS/MOS).
- Familiar with each etching single-step process (SiC etch/SiO2 etch/SiN etch/STI etch/poly etch/contact etch/metal etch/passivation etch/PR etch/Carbon etch, etc.) and the production method.
- Proficient development and learn etch’s Tool fundamental and principles of etching key assembly and components which can affect the process critical parameters.
- Familiar with the testing principle and method of etching process metrology related equipment (contour instrument, CDSEM, film thickness instrument, etc.)
- Strong teamwork spirit and effective communication skills
- Have the spirit of innovation.
- Good organization, coordination, and management skills
- Be proactive in work, be responsible.
- Have an independent problem-solving ability.