Job Responsibilities
- SiC Planar MOSFET, Trench MOSFET, SBD technology development to meet company’s technology roadmap.
- Development for manufacturability with cost effective automotive standard.
- Close collaboration with process module and packaging team in driving innovative process solutions.
- Lead or support external joint projects as assigned by supervisor.
- Lead inventor on IP and patents.
- Initiate and file patents.
Job Requirements
- Minimum 5 years wafer fab., Technology Development / Process Integration experience
- Experience in power devices & processes; SiC devices & processes experience preferred.
- Experience and knowledge in TCAD simulation, SPICE modelling.
- Knowledge in module engineering is a plus.
- Experience and knowledge in test pattern design and layout is a plus.
- Knowledge and prior experience in patents writing and filing is a plus.
- Innovative and creative
- Positive can-do altitude
- Good teamwork
- Excellent communication skills
- Powerful sense of responsibility and accountability
- Ability to work under pressure.