Senior engineer of Thin film module

Job Responsibilities

• Responsible for SiC Diode/MOS Automotive and Industrial grade products qualification in relating to AEC-Q101 and JDEC standard.
• Develop Unit Process for thin film ((Epi, CVD, PVD, Evaporation) and further optimization of the recipe.
• Support PIE to further improve Product yield and defect performance.
• Process and Metrology Tools’ Qualification from Tier 2 to Tier 3.
• Establishment Unit process capability by setting up SPC/APC/FDC to achieve CP/CpK >=1.33 minimum.
• Carry out required DOE (Design of Experiment) on each TD platform’s Unit process (Epi, CVD, PVD, Evaporation) to improve the overall Product specification margin.
• Ability to complete the work delivered by the superiors independently.

Job Requirements

• Bachelor's degree or above in microelectronics and semiconductor materials, with more than 5 years’ experience in thin film module in Si wafers processing, or 2 years’ experience in SiC direct products (JBS/MOS)
• Familiar with thin film single-step process (Epi, CVD, PVD, Evaporation etc.) and production method
• Proficient development and learn thin film’s (Epi, CVD, PVD, Evaporation, etc.). Tool fundamental and principles of thin film key assembly and components which can affect the process critical parameters.
• Familiar with the testing principles and methods of thin film process metrology related equipment (FTIR, RS, membrane thickness meter, particle meter, stress meter, etc.).
• Strong teamwork spirit and persuasive communication skills.
• Innovative spirit.
• Good ability of organization, coordination, and management.
• Be proactive in work, be responsible.
• Have an independent problem-solving ability.