Job Responsibilities
- Responsible for SiC Diode/MOS Automotive and Industrial grade products qualification in relating to AEC-Q101 and JDEC standard.
- Develop Unit Process for lithography (Track, exposure, etc) and further optimization of the recipe.
- Support PIE to further improve Product yield and defect performance.
- Process and Metrology Tools’ Qualification from Tier 2 to Tier 3.
- Establishment Unit process capability by setting up SPC/APC/FDC to achieve CP/CpK >=1.33 minimum.
- Carry out required DOE (Design of Experiment) on each TD platform’s Unit process to improve the overall Product specification margin.
- Ability to complete the work delivered by the superiors independently.
Job Requirements
- Bachelor's degree or above in microelectronics and semiconductor materials, with more than 5 years’ experience in lithography module in Si wafers processing, or 2 years’ experience in SiC direct products (JBS/MOS)
- Familiar with each lithography single-step process (Track、Exposure、Oven、UV, etc.) and the production method.
- Proficient development and learn lithography’s Tool fundamental and principles of lithography key assembly and components which can affect the process critical parameters.
- Be familiar with the testing principles and methods of lithography testing related equipment (membrane thickness instrument, CDSEM, Overlay, etc.).
- Have a team cooperation spirit, effective communication skills.
- Innovative spirit
- Good ability to organize, coordinate and manage teams.
- Be proactive in work, be responsible.
- Have an independent problem-solving ability.