Date
27 Jul 2023
Time
9:00 - 17:15 (HKT GMT+8)
Venue
Charles K Kao Auditorium. Hong Kong Science Park
The HKSAR Government has been continuously demonstrating its determination to empower Hong Kong as the global Innovation and Technology hub, and putting relentless efforts in growing our city’s startup ecosystem. Echoing the government’s advocacy on robotics technologies development and in celebration of CUHK’s 60th anniversary, the CUHK T Stone Robotics Institute (CURI) is joining hands with Hong Kong Science Park to present the CUHK Robotics Open Day cum HKSTP, Lenovo Group, and HKCLR Collaboration Agreement Signing Ceremony on 27 July 2023.