Company
Doctech HK Limited is a semiconductor company adopting a newly developed nano-twin copper material especially for the applications of three-dimensional integrated circuit (3DIC) packing. Doctech focuses on the development and commercialisation of nt-Cu as a promising nanomaterial in redistribution layers (RDLs), Cu interconnects and micro-pillar for consumer electronics. Our goal is to innovate scalable and novel nt-Cu for constructing key devices with the features of low-power consumption and transferability and to provide solutions and platform technologies. The nt-Cu material features a promising Cu-Cu bonding technology, which can provide a lower interfacial resistance, making it an ideal technology for the future hybrid Cu-Cu bonding of monolithic three-dimensional (M3D) ICs packing.
Description
A semiconductor material supplier developing a new metallisation process especially for future needs of the packaging industry
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