TR Semiconductor HK Limited2237db1b-ed4a-ef11-a316-0022485869f4_CompanyLogo_18102024

TR Semiconductor (HK) Limited

Company

Elden Chan - Managing Director
Peter Chan - Chief Technical Officer

Description

TR SEMICONDUCTOR has invented a disruptive technology that can reform the entire ecosystem of power semiconductor devices, addressing the long-standing issue of traditional packaging – the dilemma between high power delivery and efficient heat dissipation. This technology leverages revolutionary Fan-Out Panel Level Packaging (FOPLP) and patented (PCT) Top-Side Cooling Technology.

Our Beliefs

By establishing system-level optimisation standards through FOPLP + Top Side Cooling, we are elevating power semiconductor competition from isolated "chip-process centric" technology races to battles for ecosystem dominance.

More than a technical leap, this marks a strategic strike by new productive forces against traditional manufacturing paradigms.

Product

TR Semiconductor HK LimitedProductImg12237db1b-ed4a-ef11-a316-0022485869f4_ProductImage1_18082025
TR Semiconductor HK LimitedProductImg22237db1b-ed4a-ef11-a316-0022485869f4_ProductImage2_18082025
TR Semiconductor HK LimitedProductImg32237db1b-ed4a-ef11-a316-0022485869f4_ProductImage3_18082025
The only company in the industry that adopts FOPLP for the manufacturing of MOSFET power modules. This method effectively reduces package thermal resistance, increases power density, and significantly decreases PCB footprints.

Technology

Advance Power Semiconductor packaging design, system-level application optimisation.
Fan-Out Panel Level Packaging (FOPLP), power module packaging without lead frame and bond wire/copper clip. Massively reduced PCB footprints while maintaining/exceeding the thermal performance of classical power device packaging.