Company
Elden Chan - Managing Director
Peter Chan - Chief Technical Officer
Description
Turnkey solutions provider of highly integrated BLDC Motor Driver using Fan-Out Panel-Level Packaging (FOPLP) technology, featuring excellent heat dissipation capability within ultra tiny footprints
Technology
Advance Power Semiconductor packaging design.
Fan-Out Panel Level Packaging (FOPLP), power module packaging without lead frame and bond wire/copper clip. Massively reduced PCB footprints while maintaining/exceeding the thermal performance of classical power device packaging.
Fan-Out Panel Level Packaging (FOPLP), power module packaging without lead frame and bond wire/copper clip. Massively reduced PCB footprints while maintaining/exceeding the thermal performance of classical power device packaging.
