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TR Semiconductor HK Limited2237db1b-ed4a-ef11-a316-0022485869f4_CompanyLogo_18102024
Electronics

TR Semiconductor (HK) Limited

Company

Elden Chan - Managing Director
Peter Chan - Chief Technical Officer

Description

Turnkey solutions provider of highly integrated BLDC Motor Driver using Fan-Out Panel-Level Packaging (FOPLP) technology, featuring excellent heat dissipation capability within ultra tiny footprints

Our Beliefs

Turn complicated BLDC Motor Control Solutions into commodity-like products.
Reshape the future of Power Semiconductor Packaging in China.

Product

TR Semiconductor HK LimitedProductImg12237db1b-ed4a-ef11-a316-0022485869f4_ProductImage1_18102024
TR Semiconductor HK LimitedProductImg22237db1b-ed4a-ef11-a316-0022485869f4_ProductImage2_18102024
TR Semiconductor HK LimitedProductImg32237db1b-ed4a-ef11-a316-0022485869f4_ProductImage3_18102024
The only company in the industry that adopts FOPLP for manufacturing MOSFET Power Modules. Effectively reduce package resistance, increase power density, and significantly smaller PCB footprints.

Technology

Advance Power Semiconductor packaging design.
Fan-Out Panel Level Packaging (FOPLP), power module packaging without lead frame and bond wire/copper clip. Massively reduced PCB footprints while maintaining/exceeding the thermal performance of classical power device packaging.

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